Reflow soldering systems 551.10, 551.15 and 551.19551.10._freigestellt1

The soldering system 551.10 is a new development made by SEF and combines the competence of more than 30 years in the manufacturing of reflow ovens with modern requirements regarding usability, low power consumption and interfaces for the communication with other devices.

The basic system is designed as a desk top model and is equipped with eight heating zones, 4 upper and 4 bottom zones.The heating zones emit convection heat with the help of hot air fans. The upper part of the heating chamber contains additionally a cooling zone and an exhaust hood at the inlet area as well as at the outlet area.

The transport of the PCBs follows via a mesh belt. The operation of the soldering system is done with the help of a modern 7” touch panel. A 1-channel temperature profiler is integrated to check the soldering profile. The necessary thermocouple is included in the delivery.

Special version 551.15:

Here the cooling zone will be replaced by an additional heating zone so that the oven has 5 upper and 5 bottom heating zones. The cooling takes place by fans which will be mounted at the machine hood above the outlet area.




Technical data551.10551.19
Length:2010 mm3106 mm
Width:790 mm850 mm
- - incl. light pole
550 mm
710 mm
1270 mm
1432,50 mm
Weight:190 kg474 kg
Usable working width:405 mm405 mm
Active heating chamber
850 mmup to 2125 mm
Inlet height:45 mm45 mm
Conveyor speed:
- - typical
15 cm/min – 90 cm/min
20 cm/min
15 cm/min – 90 cm/min
45 cm/min
Heating power:max. 12 kWmax. 21 kW
Connection values:3 x 230/400 VAC/N/PE 50 Hz
with 16 A CEECON connector
3 x 230/400 VAC/N/PE 50 Hz
with 32 A CEECON connector
Operation:7“ Touchpanel7“ Touchpanel

For more informations please read our product flyer: 551.10,15+19_EN